| Mfg Part Number: 334064P01 | Manufacturer: Howden Fluid Systems | NSN : 5962-01-312-0598 |
| NIIN : 013120598 | Item Name : microcircuit memory | CAGE Code : 33654 |
| FSC : 5962 Microcircuits Electronic |
Thank you for your interest in the 334064P01 part of Microcircuit Memory, we have in stock on Integrated NSN. This particular Howden Fluid Systems item is listed alongside the NSN 5962-01-312-0598 and part number 334064P01 for your ease of search. With current availability for this item, we encourage you to take advantage of our Instant RFQ service in order to acquire a competitive quote for your comparisons. As our team members can be contacted 24/7x365, responses to requests or inquiries are completed with haste.
Take your time to explore our listing of part numbers like 334064P01 and you will find that the NSN 5962-01-312-0598 can be found listed under FSC 5962 Microcircuits Electronic and CAGE Code 33654. However, we carry a myriad of other NSN parts, all of which have been sourced from reputable distributors like Howden Fluid Systems. Kickoff the procurement process with a quote request that includes all of your part requirements and see how Integrated NSN can serve as your go-to sourcing solution. For additional questions, call or email us directly; we are ready to help you meet your operational deadlines however necessary.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-312-0598 Item Description: Microcircuit Memory | 5962 | 013120598 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 334064p01 | 1 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.357 INCHES MINIMUM AND 0.432 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
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